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prEN IEC 62878-2-603:2023

Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity

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91/1901/CDV; prEN IEC 62878-2-603:2023
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prEN IEC 62878-2-603:2023
This document specifies the electrical test method to detect electricalconnectivity defects of the stacked electronic module caused by the stacking assembly process to stack some stackable electronic modules.
This method is realized to make use of bidirectional serial communication bus interface applied to the stackable electronic modules which are assured as Known Good Module.

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