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EVS-EN IEC 61191-1:2018

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

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Kehtiv alates 16.11.2018
Alusdokumendid
IEC 61191-1:2018; EN IEC 61191-1:2018
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Standardi ajalugu

Staatus
Kuupäev
Tüüp
Nimetus
16.11.2018
Põhitekst
07.10.2013
Põhitekst
IEC 61191-1:2018 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. This part of IEC 61191 also includes recommendations for good manufacturing processes. This edition includes the following significant technical changes with respect to the previous edition:
- the requirements have been updated to be compliant with the acceptance criteria in IPC‑A-610F;
- the term "assembly drawing" has been changed to "assembly documentation" throughout;
- references to IEC standards have been corrected;
- Clause 9 was completely rewritten;
- Annex B was removed because there are already procedures for circuit board assemblies.

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Põhitekst

EVS-EN 61191-2:2017

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
Uusim versioon Kehtiv alates 01.11.2017
Põhitekst

EVS-EN 61191-3:2017

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
Uusim versioon Kehtiv alates 18.09.2017
Põhitekst

EVS-EN 61191-4:2017

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
Uusim versioon Kehtiv alates 01.11.2017
Põhitekst

EVS-EN 61191-6:2010

Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
Uusim versioon Kehtiv alates 07.06.2010