Tagasi

EVS-EN 61191-6:2010

Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method

Üldinfo
Kehtiv alates 07.06.2010
Alusdokumendid
IEC 61191-6:2010; EN 61191-6:2010
Direktiivid või määrused
puuduvad

Standardi ajalugu

Staatus
Kuupäev
Tüüp
Nimetus
07.06.2010
Põhitekst
This part of IEC 61191 specifies the evaluation criteria for voids on the scale of the thermal cycle life, and the measurement method of voids using X-ray observation. This part of IEC 61191 is applicable to the voids generated in the solder joints of BGA and LGA soldered on a board. This part of IEC 61191 is not applicable to the BGA package itself before it is assembled on a board.
*
*
*
PDF
23,18 € koos KM-ga
Paber
23,18 € koos KM-ga
Sirvi standardit alates 2,44 € koos KM-ga
Standardi monitooring

Teised on ostnud veel

Põhitekst

EVS-EN 61191-2:2017

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
Uusim versioon Kehtiv alates 01.11.2017
Põhitekst

EVS-EN IEC 61191-1:2018

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Uusim versioon Kehtiv alates 16.11.2018