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EVS-EN IEC 61188-6-2:2021

Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)

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Kehtiv alates 01.04.2021
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IEC 61188-6-2:2021; EN IEC 61188-6-2:2021
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Nimetus
01.04.2021
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IEC 61188-6-2:2021 describes the requirements of design and use for soldering surfaces of land pattern on circuit boards. This document includes land pattern for surface mounted components. These requirements are based on the solder joint requirements of IEC 61191‑2:2017.

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EVS-EN IEC 61188-6-1:2021

Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards
Uusim versioon Kehtiv alates 15.04.2021
Põhitekst

EVS-EN 61188-7:2017

Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
Uusim versioon Kehtiv alates 05.07.2017
Põhitekst

EVS-EN IEC 61188-6-4:2019

Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design
Uusim versioon Kehtiv alates 16.07.2019
Põhitekst

EVS-EN IEC 61188-6-3:2025

Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)
Uusim versioon Kehtiv alates 17.02.2025