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EVS-EN IEC 61188-6-1:2021

Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards

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Kehtiv alates 15.04.2021
Alusdokumendid
IEC 61188-6-1:2021; EN IEC 61188-6-1:2021
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Standardi ajalugu

Staatus
Kuupäev
Tüüp
Nimetus
15.04.2021
Põhitekst
01.03.2003
Põhitekst
IEC 61188-6-1:2021 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.

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EVS-EN IEC 61188-6-2:2021

Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)
Uusim versioon Kehtiv alates 01.04.2021
Põhitekst

EVS-EN 61188-7:2017

Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
Uusim versioon Kehtiv alates 05.07.2017
Põhitekst

EVS-EN IEC 61188-6-4:2019

Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design
Uusim versioon Kehtiv alates 16.07.2019