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EVS-EN 61188-5-1:2002

Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements

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Kehtetu alates 15.04.2021
Alusdokumendid
IEC 61188-5-1:2002; EN 61188-5-1:2002
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Nimetus
15.04.2021
Põhitekst
01.03.2003
Põhitekst
Provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and tolerance of surface-mount land patterns to insure sufficient area for the appropriate solder fillet, and also to allow for inspection, testing, and rework of those solder joints.
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