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EVS-EN 60068-2-20:2008

Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads

General information
Withdrawn from 17.05.2021
Base Documents
IEC 60068-2-20:2008; EN 60068-2-20:2008
Directives or regulations
None

Standard history

Status
Date
Type
Name
17.05.2021
Main
05.12.2008
Main
Main
EVS-HD 323.2.20 S3:2003
This part of IEC 60068 outlines Test T, applicable to devices with leads. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58. This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures in this standard include the solder bath method and soldering iron method.
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