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EVS-EN 60068-2-54:2008

Environmental testing -- Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method

General information

Withdrawn from 16.06.2017
Base Documents
IEC 60068-2-54:2006; EN 60068-2-54:2006
Directives or regulations
None

Standard history

Status
Date
Type
Name
16.06.2017
Main
07.02.2008
Main
Main
EVS-HD 323.2.54 S1:2003
This part of IEC 60068 outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable for reference testing and for components that cannot be quantitatively tested by other methods. For surface mounting devices (SMD), IEC 60068-2-69 should be applied if it is suitable. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.

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