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EVS-EN 60068-2-83:2011

Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance methodusing solder paste

General information

Withdrawn from 01.08.2025
Base Documents
IEC 60068-2-83:2011; EN 60068-2-83:2011
Directives or regulations
None

Standard history

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Date
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This part of IEC 60068 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes. Data obtained by these methods are not intended to be used as absolute quantitative data for pass – fail purposes.

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