Skip to main content
Back

EVS-EN IEC 60068-2-83:2025

Environmental testing - Part 2-83: Tests - Test tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

General information

Valid from 01.08.2025
Base Documents
IEC 60068-2-83:2025; EN IEC 60068-2-83:2025
Directives or regulations
None

Standard history

Status
Date
Type
Name
IEC 60068-2-83:2025 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder paste. Data obtained by these methods are not intended to be used as absolute quantitative data for pass/fail purposes.
NOTE Different solderability test methods for SMD are described in IEC 60068‑2‑58 and IEC 60068‑2‑69. IEC 60068‑2‑58 specifies visual evaluation using solder bath and reflow method, IEC 60068‑2‑69 specifies wetting balance evaluation using solder bath and solder globule method.
This edition includes the following significant technical change with respect to the previous edition:
a) revise Clause 5 to align with that in IEC 60068‑2‑20:2021.

Required fields are indicated with *

*
*
*
PDF
27.28 € incl tax
Paper
27.28 € incl tax
Browse standard from 2.48 € incl tax
Standard monitoring