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EVS-EN 60191-6-17:2011

Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (P-PFBGA and P-PFLGA)

General information

Valid from 04.05.2011
Base Documents
IEC 60191-6-17:2011; EN 60191-6-17:2011
Directives or regulations
None

Standard history

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Date
Type
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This part of IEC 60191 provides outline drawings and dimensions for stacked packages and individual stackable packages in the form of FBGA or FLGA.

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