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EVS-EN 60749-19:2003

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

General information
Valid from 06.10.2003
Base Documents
IEC 60749-19:2002; EN 60749-19:2003
Directives or regulations
None

Standard history

Status
Date
Type
Name
04.11.2010
Amendment
06.10.2003
Main
Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates. Generally only applicable to cavity packages or as a process monitor
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