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EVS-EN 60749-39:2006

Semiconductor devices - Mechanical and climatic test methods -- Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components

General information

Withdrawn from 01.02.2022
Base Documents
IEC 60749-39:2006; EN 60749-39:2006
Directives or regulations
None

Standard history

Status
Date
Type
Name
01.02.2022
Main
06.10.2006
Main
This part of IEC 60749 details the procedures for the measurement of the characteristic properties of moisture diffusivity and water solubility in organic materials used in the packaging of semiconductor components. These two material properties are important parameters for the effective reliability performance of plastic packaged semiconductors after exposure to moisture and being subjected to high-temperature solder reflow.

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