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EVS-EN 62047-25:2016

Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area

General information
Valid from 06.12.2016
Base Documents
IEC 62047-25:2016; EN 62047-25:2016
Directives or regulations
None
Standard history
Status
Date
Type
Name
06.12.2016
Main
IEC 62047-25:2016 specifies the in-situ testing method to measure the bonding strength of micro bonding area which is fabricated by micromachining technologies used in silicon-based micro-electromechanical system (MEMS). This document is applicable to the in-situ pull-press and shearing strength measurement of the micro bonding area fabricated by microelectronic technology process and other micromachining technology.
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