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EVS-EN 62326-4:2003

Printed boards - Part 4: Rigid multilayer boards with interlayer connections - Sectional specification

General information

Valid from 01.02.2003
Base Documents
IEC 62326-4:1996; EN 62326-4:1997
ICS Groups
31.180 Printed circuits and boards
Directives or regulations
None

Standard history

Status
Date
Type
Name
01.02.2003
Main
EVS-EN 62326-4:2003
This part of IEC 2326 is applicable to rigid multilayer printed boards irrespective of their method of manufacture. It is the basis on which agreements between manufacturer and user are to be made. This standard provides additional information necessary to supplement the requirements of the Generic Specification, IEC 2326-1, for the printed boards intended to be accepted under the IECQ.

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Standards designation

EVS Estonian standard
EN European standard (published by an CEN or CENELEC)
EN ISO International standard adopted as an European standard
ISO International Organization for Standardization’s standard
IEC International Electrotechnical Commission’s standard
HD CENELEC’s harmonisation document
   
EVS-EN European standard implemented in Estonia
EVS-EN ISO International standard adopted in Europe and implemented in Estonia
EVS-EN ISO/IEC International standard/International electrotechnical standard adopted in Europe and implemented in Estonia
EVS-IEC International electrotechnical standard implemented in Estonia
EVS-ISO International standard implemented in Estonia
   
A, AMD amedment
+A a full standard plus the amendment
/A only amendment
COR, AC corrigendum
+COR a full standard plus the corrigendum
NA national annex
+NA a full standard plus the national annex
/NA only national annex
TS technical specification
TR technical report
CWA agreement, developed by a CEN or CENELEC
prEVS-EN (etc) draft standard
   
et the standard is in Estonian only
en the standard is in English only
et-en the standard is in Parallel text Estonian-English