Back

EVS-EN IEC 61249-2-51:2023

Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for Integrated Circuit card carrier tape, unclad

General information
Valid from 03.07.2023
Base Documents
IEC 61249-2-51:2023; EN IEC 61249-2-51:2023
Directives or regulations
None

Standard history

Status
Date
Type
Name
03.07.2023
Main
IEC 61249-2-51:2023 specifies the construction, materials, property requirements, quality assurance, packaging, marking, storage of base materials for integrated circuit card carrier tape, unclad (hereinafter referred to as IC carrier tape base materials).
This document is applicable to IC carrier tape base materials, which is a glue-coated material, one side is woven E-glass reinforced epoxy underlayer, and the other side is coated with adhesive and protected by release film.
*
*
*
PDF
15.86 € incl tax
Paper
15.86 € incl tax
Browse standard from 2.44 € incl tax
Standard monitoring