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EVS-EN IEC 63251:2023

Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress

General information
Valid from 15.12.2023
Base Documents
IEC 63251:2023; EN IEC 63251:2023
Directives or regulations
None

Standard history

Status
Date
Type
Name
15.12.2023
Main
This International Standard defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards. The purpose of this standard is to accommodate the uniform thermal characteristics required by the flexible opto-electric circuit in high temperature environments such as automobiles. In particular, this standard specifies a test method to inspect the occurrence of color exchange, deformation and delamination of flexible opto-electric circuit boards under thermal stress.
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