Skip to main content
Back

IEC 60191-5:1997

Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)

General information

Valid from 23.04.1997
Directives or regulations
None

Standard history

Status
Date
Type
Name
23.04.1997
Main
Gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. Covers the requirements for tape with bonded integrated circuits (IC) as supplied by a manufacturer to a user.




Required fields are indicated with *

*
*
*
PDF
346.82 € incl tax
Paper
346.82 € incl tax
Standard monitoring