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IEC 60691:2015

Thermal-links - Requirements and application guide

General information

Withdrawn from 06.03.2023
Directives or regulations

Standard history

IEC 60691:2002+AMD1:2006+AMD2:2010 CSV
IEC 60691:2002
IEC 60691:2002/AMD2:2010
IEC 60691:2002/AMD1:2006
IEC 60694:2015 is applicable to thermal-links intended for incorporation in electrical appliances, electronic equipment and component parts thereof, normally intended for use indoors, in order to protect them against excessive temperatures under abnormal conditions. This standard may be applicable to thermal-links for use under conditions other than indoors, provided that the climatic and other circumstances in the immediate surroundings of such thermal-links are comparable with those in this standard. This standard may be applicable to thermal-links in their simplest forms (e.g. melting strips or wires), provided that molten materials expelled during function cannot adversely interfere with the safe use of the equipment, especially in the case of hand-held or portable equipment, irrespective of its position. Annex H of this standard is applicable to thermal-link packaged assemblies where the thermal-link(s) has already been approved to this standard but packaged in a metallic or non-metallic housing and provided with terminals/wiring leads. This standard is applicable to thermal-links with a rated voltage not exceeding 690 V a.c. or d.c. and a rated current not exceeding 63 A. The objectives of this standard are: to establish uniform requirements for thermal-links, to define methods of test, to provide useful information for the application of thermal-links in equipment. This standard is not applicable to thermal-links used under extreme conditions such as corrosive or explosive atmospheres. This standard is not applicable to thermal-links to be used in circuits on a.c. with a frequency lower than 45 Hz or higher than 62 Hz. This fourth edition cancels and replaces the third edition published in 2002, Amendment 1:2006 and Amendment 2:2010. This fourth edition constitutes a technical revision. This fourth edition includes the following significant technical changes with respect to the previous edition:
- requirements for thermal-link packaged assemblies;
- renew the requirements and definitions for Th-test;
- change starting temperature for interrupt current test;
- clarify requirements for marking (packing label);
- minimum Proof Tracking Index 175 instead 120. Keywords: thermal protection of equipment, thermal-links

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