IEC 60695-10-3:2002

Specifies the mould stress relief distortion test as a test method for use by product committees.
It is applicable to electrotechnical equipment including parts made from polymeric materials. This test is intended to simulate the effects caused by the relieving of moulding stresses by conditioning the product or part at a temperature higher than the maximum normal operating temperature and observing the nature of the resulting changes.
Has the status of a basic safety publication in accordance with IEC Guide 104.