IEC 60748-20-1:1994

The purpose of these examinations is to check the internal
materials, construction and workmanship of film and hybrid
integrated circuits (F and HFICs).
These examinations will normally be used prior to tapping or
encapsulation to detect and eliminate the F and HFICs with internal
defects that could lead to device failure in normal application.
Other acceptance criteria may be agreed upon with the purchaser or
supplier, respectively.