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IEC 60749-22:2002

Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

General information

Withdrawn from 26.11.2025
Directives or regulations
None

Standard history

Status
Date
Type
Name
13.08.2003
Corrigendum
12.09.2002
Main
Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements.

The contents of the corrigendum of August 2003 have been included in this copy.

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Paper
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Standard monitoring