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IEC 60749-23:2004

Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life

General information

Withdrawn from 09.12.2025
Directives or regulations
None

Standard history

Status
Date
Type
Name
27.01.2011
Amendment
23.02.2004
Main
This test is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the device operating condition in an accelerated way, and is primarily used for device qualification and reliability monitoring.

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