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IEC 60749-39:2006

Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components

General information
Withdrawn from 29.11.2021
Directives or regulations
None

Standard history

Status
Date
Type
Name
29.11.2021
Main
24.07.2006
Main
Detailed the procedures for the measurement of the characteristic properties of moisture diffusivity and water solubility in organic materials used in the packaging of semiconductor components.
These two material properties are important parameters for the effective reliability performance of plastic packaged semiconductors after exposure to moisture and being subjected to high-temperature solder reflow.
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