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IEC 61188-1-2:1998

Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance

General information

Withdrawn from 25.09.2020
Directives or regulations
None

Standard history

Status
Date
Type
Name
29.04.1998
Main
The aim in packaging is to transfer a signal from one device to one or more other devices through a conductor. High-speed designs are defined as designs in which the interconnecting properties affect circuit performance and require unique considerations.

Required fields are indicated with *

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Standard monitoring