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IEC 61188-6-4:2019

Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design

General information
Valid from 02.05.2019
ICS Groups
31.180 Printed circuits and boards
Directives or regulations
None

Standard history

Status
Date
Type
Name
02.05.2019
Main
IEC 61188-6-4:2019
IEC 61188-6-4:2019 specifies generic requirements for dimensional drawings of SMD from the viewpoint of land pattern design.
The purpose of this document is to prevent land pattern design issues caused by lack of information and/or misuse of the information from SMD outline drawing as well as to improve the utilization of IEC 61188 series. This document is applicable to the SMD of semiconductor devices and electrical components.
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Paper
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Standard monitoring
English

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EVS-EN European standard implemented in Estonia
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EVS-ISO International standard implemented in Estonia
   
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et the standard is in Estonian only
en the standard is in English only
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