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IEC 61189-2-803:2023

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards

General information
Valid from 26.07.2023
Directives or regulations
None

Standard history

Status
Date
Type
Name
26.07.2023
Main
IEC 61189-2-803:2023 specifies a test method to determine the Z-axis expansion of base materials and printed boards using a thermomechanical analyser (TMA).
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