Skip to main content
Back

IEC 61189-2-803:2023

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards

General information

Valid from 26.07.2023
Directives or regulations
None

Standard history

Status
Date
Type
Name
26.07.2023
Main
IEC 61189-2-803:2023 specifies a test method to determine the Z-axis expansion of base materials and printed boards using a thermomechanical analyser (TMA).

Required fields are indicated with *

*
*
*
PDF
26.22 € incl tax
Paper
26.22 € incl tax
Standard monitoring