Back

IEC 61189-2-804:2023

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300

General information
Valid from 25.08.2023
Directives or regulations
None

Standard history

Status
Date
Type
Name
25.08.2023
Main
IEC 61189-2-804:2023 specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyser (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 °C, but are not limited to these values.
*
*
*
PDF
26.22 € incl tax
Paper
26.22 € incl tax
Standard monitoring