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IEC 61189-2-807:2021

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA

General information
Valid from 03.09.2021
Directives or regulations
None
Standard history
Status
Date
Type
Name
03.09.2021
Main
IEC 61189-2-807:2021 specifies a test method to determine the decomposition temperature (Td) of base laminate materials using thermogravimetric analysis (TGA).
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