Skip to main content
Back

IEC 61189-2-808:2024

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method

General information

Valid from 25.04.2024
Directives or regulations
None

Standard history

Status
Date
Type
Name
25.04.2024
Main
IEC 61189-2-808:2024 describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode. This method is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink.
NOTE: This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A.

Required fields are indicated with *

*
*
*
PDF
150.78 € incl tax
Paper
150.78 € incl tax
Standard monitoring