Skip to main content
Back

IEC 61249-2-51:2023

Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad

General information

Valid from 11.05.2023
Directives or regulations
None

Standard history

Status
Date
Type
Name
11.05.2023
Main
IEC 61249-2-51:2023 specifies the construction, materials, property requirements, quality assurance, packaging, marking, storage of base materials for integrated circuit card carrier tape, unclad (hereinafter referred to as IC carrier tape base materials).
This document is applicable to IC carrier tape base materials, which is a glue-coated material, one side is woven E-glass reinforced epoxy underlayer, and the other side is coated with adhesive and protected by release film.

Required fields are indicated with *

*
*
*
PDF
150.78 € incl tax
Paper
150.78 € incl tax
Standard monitoring

Customers who bought this item also bought

Main

ISO 2322:2023

Styrene-butadiene rubber (SBR) — Emulsion- and solution-polymerized types — Evaluation procedures
Newest version Valid from 02.05.2023