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IEC 63251:2023

Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress

General information

Valid from 01.11.2023
Directives or regulations
None

Standard history

Status
Date
Type
Name
01.11.2023
Main
IEC 63251:2023 defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards. The purpose of this document is to accommodate the uniform thermal characteristics required by the flexible opto-electric circuit in high temperature environments such as automobiles. In particular, this document specifies a test method to inspect the occurrence of colour exchange, deformation and delamination of flexible opto-electric circuit boards under thermal stress.

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