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IEC TR 62866:2014

Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing

General information
Valid from 07.05.2014
Directives or regulations
None

Standard history

Status
Date
Type
Name
07.05.2014
Main
IEC TR 62866:2014 describes the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing in detail.
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