ISO/TS 10303-1698 V3:2010

ISO/TS 10303-1698:2010-07 Layered interconnect module design
  
  
      ISO/TS 10303-1698:2010-07 specifies the application module for
         Layered interconnect module design.      
        
      
      
         The following are within the scope of
         ISO/TS 10303-1698:2010-07:
        
      
      
         design features;
         material stackup;
         design patterns;
         metalization;
         functional and physical network listing;
         design layers;
         artwork layers;
         passages;
         items within the scope of application module Assembly component placement requirements, ISO/TS 10303-1634;
         items within the scope of application module Component grouping, ISO/TS 10303-1656;
         items within the scope of application module Edge shape feature, ISO/TS 10303-1673;
         items within the scope of application module Footprint definition, ISO/TS 10303-1646;
         items within the scope of application module Land, ISO/TS 10303-1692;
         items within the scope of application module Layered interconnect module with printed component design, ISO/TS 10303-1700.