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ISO/TS 10303-1698 V3:2010

Industrial automation systems and integration -- Product data representation and exchange -- Part 1698: Application module: Layered interconnect module design

General information
Withdrawn from 18.11.2014
Directives or regulations
None
Standard history
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Date
Type
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Main
ISO/TS 10303-1698:2010 V1
ISO/TS 10303-1698:2010-07 Layered interconnect module design ISO/TS 10303-1698:2010-07 specifies the application module for Layered interconnect module design. The following are within the scope of ISO/TS 10303-1698:2010-07: design features; material stackup; design patterns; metalization; functional and physical network listing; design layers; artwork layers; passages; items within the scope of application module Assembly component placement requirements, ISO/TS 10303-1634; items within the scope of application module Component grouping, ISO/TS 10303-1656; items within the scope of application module Edge shape feature, ISO/TS 10303-1673; items within the scope of application module Footprint definition, ISO/TS 10303-1646; items within the scope of application module Land, ISO/TS 10303-1692; items within the scope of application module Layered interconnect module with printed component design, ISO/TS 10303-1700.
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