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prEN IEC 63378-3:2024

Thermal standardization on semiconductor packages - Part 3: Thermal circuit simulation models of discrete semiconductor packages for transient analysis

General information

Draft
Base Documents
47D/967/CDV; prEN IEC 63378-3:2024
ICS Groups
31.080.01 Semiconductor devices in general
Directives or regulations
None

Standard history

Status
Date
Type
Name
Main
prEN IEC 63378-3:2024
This part of IEC 63378 specifies the thermal circuit network model of discrete (TO-243, TO-252 and TO-263) packages, which is used in the transient analysis of electronic devices to estimate precise junction temperatures without experimental verification.
This model is assumed to be made and provided by semiconductor suppliers and to be used by assembly makers of electronic devices.

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Standards designation

EVS Estonian standard
EN European standard (published by an CEN or CENELEC)
EN ISO International standard adopted as an European standard
ISO International Organization for Standardization’s standard
IEC International Electrotechnical Commission’s standard
HD CENELEC’s harmonisation document
   
EVS-EN European standard implemented in Estonia
EVS-EN ISO International standard adopted in Europe and implemented in Estonia
EVS-EN ISO/IEC International standard/International electrotechnical standard adopted in Europe and implemented in Estonia
EVS-IEC International electrotechnical standard implemented in Estonia
EVS-ISO International standard implemented in Estonia
   
A, AMD amedment
+A a full standard plus the amendment
/A only amendment
COR, AC corrigendum
+COR a full standard plus the corrigendum
NA national annex
+NA a full standard plus the national annex
/NA only national annex
TS technical specification
TR technical report
CWA agreement, developed by a CEN or CENELEC
prEVS-EN (etc) draft standard
   
et the standard is in Estonian only
en the standard is in English only
et-en the standard is in Parallel text Estonian-English