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EVS-EN 60068-2-54:2008

Environmental testing -- Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method

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Kehtetu alates 16.06.2017
Alusdokumendid
IEC 60068-2-54:2006; EN 60068-2-54:2006
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Standardi ajalugu

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Kuupäev
Tüüp
Nimetus
16.06.2017
Põhitekst
07.02.2008
Põhitekst
Põhitekst
EVS-HD 323.2.54 S1:2003
This part of IEC 60068 outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable for reference testing and for components that cannot be quantitatively tested by other methods. For surface mounting devices (SMD), IEC 60068-2-69 should be applied if it is suitable. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.
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