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EVS-EN 60749-35:2006

Semiconductor devices - Mechanical and climatic test methods -- Part 35: Acoustic microscopy for plastic encapsulated electronic components

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Kehtiv alates 06.11.2006
Alusdokumendid
IEC 60749-35:2006; EN 60749-35:2006
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06.11.2006
Põhitekst
This part of IEC 60749 defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. This standard provides a guide to the use of acoustic microscopy for detecting anomalies (delamination, cracks, mould-compound voids, etc.) reproducibly and non-destructively in plastic packages.
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