IEC 60512-9-5:2020 when required by the detail product specification, is used for testing connectors or solderless connections within the scope of technical committee 48. It may also be used for similar devices when specified in a detail product specification. The object of this document is to detail a standard method for subjecting solderless connections to thermal stress conditioning by cyclic current loading. This second edition cancels and replaces the first edition published in 2010. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:
- added method B and renamed the former test method as method A, to provide an alternative with more adjustable time “ON” and “OFF” for products with larger thermal mass.
- added introduction to provide background of this revision.