Skip to main content
Tagasi

IEC 60749-5:2023

Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test

Üldinfo

Kehtiv alates 19.12.2023
Direktiivid või määrused
puuduvad

Standardi ajalugu

Staatus
Kuupäev
Tüüp
Nimetus
19.12.2023
Põhitekst
IEC 60749-5:2023 is available as IEC 60749-5:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60749-5:2023 provides a steady-state temperature and humidity bias life test to evaluate the reliability of non-hermetic packaged semiconductor devices in humid environments. This test method is considered destructive. This edition includes the following significant technical changes with respect to the previous edition:
a) The specification of the test equipment is changed to require the need to minimize relative humidity gradients and maximize air flow between semiconductor devices under test;
b) The specification of the test equipment fixtures is changed to require the avoidance of condensation on devices under test and on electrical fixtures connecting the devices to the test equipment;
c) replacement of references to “virtual junction” with “die”.

Nõutud väljad on tähistatud *

*
*
*
PDF
52,45 € koos KM-ga
PDF redline
73,43 € koos KM-ga
Paber
52,45 € koos KM-ga
Standardi monitooring