Back

EVS-EN 60749-20:2009

Semiconductor devices - Mechanical and climatic test methods -- Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

General information
Withdrawn from 15.10.2020
Base Documents
IEC 60749-20:2009; EN 60749-20:2009
Directives or regulations
None
Standard history
Status
Date
Type
Name
15.10.2020
Main
06.01.2010
Main
Main
EVS-EN 60749-20:2003
This part of IEC 60749 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive.
*
*
*
PDF
16.70 € incl tax
Paper
16.70 € incl tax
Price: 2.40 € incl tax
Standard monitoring