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EVS-EN 61760-3:2010

Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering

General information

Withdrawn from 01.04.2021
Base Documents
IEC 61760-3:2010; EN 61760-3:2010
Directives or regulations
None

Standard history

Status
Date
Type
Name
01.04.2021
Main
07.06.2010
Main
This International Standard gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through hole reflow soldering technology.

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