Back

EVS-EN 62047-10:2011

Semiconductor devices - Microelectromechanical devices - Part 10: Micro-pillar compression test for MEMS materials

General information
Valid from 04.10.2011
Base Documents
IEC 62047-10:2011; EN 62047-10:2011
Directives or regulations
None

Standard history

Status
Date
Type
Name
04.10.2011
Main
This part of IEC 62047 specifies micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication. The uniaxial compressive stress-strain relationship of a specimen is measured, and the compressive modulus of elasticity and yield strength can be obtained. The test piece is a cylindrical pillar fabricated on a rigid (or highly stiff) substrate by micromachining technologies, and its aspect ratio (ratio of pillar diameter to pillar height) should be more than 3. This standard is applicable to metallic, ceramic, and polymeric materials.
*
*
*
PDF
10.98 € incl tax
Paper
10.98 € incl tax
Browse standard from 2.44 € incl tax
Standard monitoring

Customers who bought this item also bought

Main

EVS-EN 62047-1:2016

Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
Newest version Valid from 03.05.2016
Main

EVS-EN 62047-2:2006

Semiconductor devices - Micro-electromechanical devices -- Part 2: Tensile testing methods of thin film materials
Newest version Valid from 06.11.2006
Main

EVS-EN 62047-3:2006

Semiconductor devices - Micro-electromechanical devices -- Part 3: Thin film standard test piece for tensile-testing
Newest version Valid from 06.11.2006
Main

EVS-EN 62047-6:2010

Semiconductor devices - Micro-electromechanical devices -- Part 6: Axial fatigue testing methods of thin film materials
Newest version Valid from 06.05.2010