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EVS-EN IEC 60749-10:2022

Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - device and subassembly

General information

Valid from 15.06.2022
Base Documents
IEC 60749-10:2022; EN IEC 60749-10:2022
ICS Groups
31.080.01 Semiconductor devices in general
Directives or regulations
None

Standard history

Status
Date
Type
Name
15.06.2022
Main
EVS-EN IEC 60749-10:2022
01.03.2003
Main
EVS-EN 60749-10:2003
IEC 60749-10:2022 is intended to evaluate devices in the free state and assembled to printed wiring boards for use in electrical equipment. The method is intended to determine the compatibility of devices and subassemblies to withstand moderately severe shocks. The use of subassemblies is a means to test devices in usage conditions as assembled to printed wiring boards. Mechanical shock due to suddenly applied forces, or abrupt change in motion produced by handling, transportation or field operation can disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test intended for device qualification.

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Standard monitoring
English (PDF 645 KB)

Related products

Main

EVS-EN IEC 60747-5-5:2020

Semiconductor devices - Part 5-5: Optoelectronic devices - Photocouplers
Newest version Valid from 02.10.2020
Main

EVS-EN 60749-34:2010

Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
Newest version Valid from 05.01.2011
Amendment

EVS-EN 60747-5-5:2011/A1:2015

Semiconductor devices - Discrete devices - Part 5-5: Optoelectronic devices - Photocouplers
Withdrawn from 02.10.2020
Main

EVS-EN IEC 60749-26:2018

Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
Newest version Valid from 02.04.2018

Standards designation

EVS Estonian standard
EN European standard (published by an CEN or CENELEC)
EN ISO International standard adopted as an European standard
ISO International Organization for Standardization’s standard
IEC International Electrotechnical Commission’s standard
HD CENELEC’s harmonisation document
   
EVS-EN European standard implemented in Estonia
EVS-EN ISO International standard adopted in Europe and implemented in Estonia
EVS-EN ISO/IEC International standard/International electrotechnical standard adopted in Europe and implemented in Estonia
EVS-IEC International electrotechnical standard implemented in Estonia
EVS-ISO International standard implemented in Estonia
   
A, AMD amedment
+A a full standard plus the amendment
/A only amendment
COR, AC corrigendum
+COR a full standard plus the corrigendum
NA national annex
+NA a full standard plus the national annex
/NA only national annex
TS technical specification
TR technical report
CWA agreement, developed by a CEN or CENELEC
prEVS-EN (etc) draft standard
   
et the standard is in Estonian only
en the standard is in English only
et-en the standard is in Parallel text Estonian-English