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EVS-EN IEC 60749-23:2026

Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life

General information

Valid from 16.02.2026
Base Documents
EN IEC 60749-23:2026; IEC 60749-23:2025
Directives or regulations
None

Standard history

Status
Date
Type
Name
This test is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the device operating condition in an accelerated way, and is primarily for device qualification and reliability monitoring. A form of high temperature bias life using a short duration, popularly known as “burn-in”, may be used to screen for infant mortality related failures. The detailed use and application of burn-in is outside the scope of this standard.

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