Skip to main content
Tagasi

EVS-EN 61190-1-3:2007

Attachment materials for electronic assembly -- Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

Üldinfo

Kehtetu alates 16.03.2018
Alusdokumendid
IEC 61190-1-3:2007; EN 61190-1-3:2007
Direktiivid või määrused
puuduvad

Standardi ajalugu

Staatus
Kuupäev
Tüüp
Nimetus
16.03.2018
Põhitekst
06.09.2007
Põhitekst
Põhitekst
EVS-EN 61190-1-3:2003
This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for “special” electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453, ISO 9454-1 and ISO 9454-2. This standard is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process

Nõutud väljad on tähistatud *

*
*
*
PDF
27,28 € koos KM-ga
Paber
27,28 € koos KM-ga
Sirvi standardit alates 2,48 € koos KM-ga
Standardi monitooring