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EVS-EN 61191-3:2002

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

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Kehtetu alates 18.09.2017
Alusdokumendid
IEC 61191-3:1998; EN 61191-3:1998
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Standardi ajalugu

Staatus
Kuupäev
Tüüp
Nimetus
18.09.2017
Põhitekst
01.01.2003
Põhitekst
This standard prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).
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