Skip to main content
Tagasi

IEC 61191-3:2017

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

Üldinfo

Kehtiv alates 30.05.2017
Direktiivid või määrused
puuduvad

Standardi ajalugu

Staatus
Kuupäev
Tüüp
Nimetus
30.05.2017
Põhitekst
Põhitekst
IEC 61191-3:2017(E) prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e.. surface mount, chip mounting, terminal mounting).
This edition includes the following significant technical changes with respect to the previous edition:
a) The requirements have been updated to be compliant wit the acceptance criteria in IPC-A-610F.

Nõutud väljad on tähistatud *

*
*
*
PDF
150,78 € koos KM-ga
Paber
150,78 € koos KM-ga
Standardi monitooring