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EVS-EN 60749-21:2005

Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability

General information
Withdrawn from 06.09.2011
Base Documents
IEC 60749-21:2004; EN 60749-21:2005
Directives or regulations
None

Standard history

Status
Date
Type
Name
Establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead or lead-free solder for the attachment. Provides a procedure for 'dip and look' solderability testing of through hole, axial and surface mount devices as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application.
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