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EVS-EN 62047-18:2013

Semiconductor devices - Micro-electromechanical devices -- Part 18: Bend testing methods of thin film materials

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Kehtiv alates 14.11.2013
Alusdokumendid
IEC 62047-18:2013; EN 62047-18:2013
Tegevusala (ICS grupid)
31.080.99 Muud pooljuhtseadised
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14.11.2013
Põhitekst
IEC 62047-18:2013 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 micrometre and 10 micrometre. This International Standard specifies the bend testing and test piece shape for micro-sized smooth cantilever type test pieces, which enables a guarantee of accuracy corresponding to the special features.
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EVS-EN 62047-16:2015

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EVS-EN 62047-11:2013

Semiconductor devices - Micro-electromechanical devices -- Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
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EVS-EN 62047-19:2013

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