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EVS-EN 61192-3:2003

Workmanship requirements for soldered electronic assemblies Part 3: Through-hole mount assemblies

Üldinfo
Kehtetu alates 02.05.2019
Alusdokumendid
IEC 61192-3:2002; EN 61192-3:2003
Direktiivid või määrused
puuduvad
Standardi ajalugu
Staatus
Kuupäev
Tüüp
Nimetus
01.07.2003
Põhitekst
Specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally through-hole or mixed assemblies that include surface-mounting or other related assembly technologies, for example, terminals, wires
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